Our Revolutionary Epoxy Molding System
Fast, Stable and Flame Resistant
Vpoxy is a proprietary epoxy molding system designed for very fast molding cycles and excellent shelf stability. This revolutionary system requires low transfer pressures to achieve optimum cavity fill, while providing excellent moisture protection and leadwire adhesion.
The material is a soft-flow, mineral-filled, fiberglass-reinforced epoxy molding compound that meets the UL 94 V-0 flammability rating. It is designed for use in both transfer and screw injection molding equipment.
Vpoxy exhibits exceptional shelf stability while maintaining a rapid curing process and is considerably less abrasive than ordinary silica-filled materials.
UL1446, Class F, Encapsulated coil system available upon request.
Physical Properties
| Filler | Mineral/Fiberglass |
| Form | Granular |
| Bulk Density (gm/cc) | 0.90 |
| Spiral Flow (in) | 30 - 40 |
| Hot Plate Cure (sec) | 30 - 40 |
| Molded Density (gm/cc) | 2.00 |
| Mold Shrinkage (cc/cm) | 0.006 |
Electrical Properties
| Dielectric Constant (@23°C, 1 KHz) | 4.7 |
| Dissipation Factor (@23°C, 1 KHz) | 0.006 |
| Loss Factor (1 KHz) | 0.020 |
| Arc Resistance (seconds) | 190 |
| Dielectric Strength (volts/ml) | 450 |
*Values based on generic testing for this type system. Subject to revision.
Mechanical Properties
| Flexural Strength (kg/cm²) | 1,100 |
| Tensile Strength (kg/cm²) | 750 |
| Hardness (Shore D) | 90 |
| Izod Impact (kg-m/cm of notch) | 0.022 |
Storage & Handling
Material should be stored in closed and sealed containers. Allow refrigerated material to equilibrate to room temperature before opening. Shelf Life * @ 72°F 12 months.
Thermal Properties
| Thermal Conductivity (cal/cm-sec-°C x 104) | 30 |
| Max Intermittent Operation Temperature | 210°C |